Title:
積層制振構造
Document Type and Number:
Japanese Patent JP6917738
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make a damping layer thinner while securing a vibration reduction performance.SOLUTION: A laminate damping structure (damping material 30) has a laminate body 38 in which damping layers 36 softer than a plate 22 are laminated on both surfaces of n pieces of plates 22, and restraining plates 32 which restrain an outer surface of the damping layer 36.SELECTED DRAWING: Figure 1
Inventors:
Ryuta Inoue
Hirokazu Yoshioka
Hirokazu Yoshioka
Application Number:
JP2017047261A
Publication Date:
August 11, 2021
Filing Date:
March 13, 2017
Export Citation:
Assignee:
TAKENAKA CORPORATION
International Classes:
F16F15/04; B32B13/00; F16F1/40; F16F15/02
Domestic Patent References:
| JP63091240A | ||||
| JP2014166764A | ||||
| JP2008150842A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda