Title:
貼り合わせウェーハ及びその製造方法
Document Type and Number:
Japanese Patent JP5028845
Kind Code:
B2
Abstract:
A bonded wafer is produced by bonding an ion-implanted wafer for an active layer onto a wafer for a supporting substrate, and thereafter exfoliating the wafer for the active layer at the ion-implanted position through a heat treatment and then polishing a terrace portion of the resulting active layer with a predetermined fixed grain abrasive cloth to remove island-shaped projections on the terrace portion while controlling a scattering of terrace width and smoothness of an outer peripheral face of the active layer.
Inventors:
Etsuro Morita
Kazuo Fujie
Ono Isoroku
Kazuo Fujie
Ono Isoroku
Application Number:
JP2006112460A
Publication Date:
September 19, 2012
Filing Date:
April 14, 2006
Export Citation:
Assignee:
Sumco inc.
International Classes:
B24B9/00; H01L21/304; B24D3/00; B24D3/02; B24D3/28; B24D5/02; B24D11/00
Domestic Patent References:
| JP2001027999A1 | ||||
| JP2006093655A | ||||
| JP2003101668A1 | ||||
| JP2004311526A | ||||
| JP2002299290A | ||||
| JP2004146461A | ||||
| JP2005038978A | ||||
| JP2004337992A | ||||
| JP2002305292A |
Attorney, Agent or Firm:
Kenji Sugimura
Kosaku Sugimura
Shiro Fujitani
Kiyoshi Kuruma
Kosaku Sugimura
Shiro Fujitani
Kiyoshi Kuruma