Title:
LAMINATED WIRING BOARD, TOUCH PANEL AND THEIR MANUFACTURING METHODS
Document Type and Number:
Japanese Patent JP3879651
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated wiring board in which decreases in yields, reliabilities and productivities are not introduced even though the materials of laminated wiring board are different and a touch panel, and to provide the laminated wiring board and the touch panel at a low cost with proper productivities.
SOLUTION: The laminated wiring board includes wiring forming surfaces of a plurality of wiring boards 1 and 11 for constituting at least a part of an electrical circuit, laminated to face each other. Electrical connectors 3 and 13 between the boards 1 and 11 are connected via an elastic conductive material 4 adhered only onto one of the boards 1, so that at least a part of a peripheral edge portion of the material 4 is adhered with a double-sided adhesive material 5 to seal a plurality of the wiring boars 1 and 11.
Inventors:
Hirano Tomio
Masao Ono
Nobuyuki Oikawa
Masao Ono
Nobuyuki Oikawa
Application Number:
JP2002306146A
Publication Date:
February 14, 2007
Filing Date:
October 21, 2002
Export Citation:
Assignee:
ソニー株式会社
International Classes:
G06F3/041; H05K1/14; G06F3/045; G06F3/047; H01H11/00; H01H13/712; H05K1/03; H05K3/36; H05K3/30; H05K3/32; (IPC1-7): H05K1/14; G06F3/033; H01H11/00; H01H13/70; H05K3/36
Domestic Patent References:
| JP1209795A | ||||
| JP2002176238A | ||||
| JP1221831A |
Attorney, Agent or Firm:
Yoshitsuno Kakuda
Hironobu Isoyama
Hironobu Isoyama