Title:
積層体およびキット
Document Type and Number:
Japanese Patent JP6514770
Kind Code:
B2
Abstract:
The laminate includes a water-soluble resin layer containing a water-soluble resin and a photosensitive resin layer containing a photosensitive resin, which are provided in this order on an organic semiconductor film. The water-soluble resin layer and the photosensitive resin layer are adjacent to each other, the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater, and the photosensitive resin has a weight-average molecular weight of 30,000 or greater.
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Inventors:
Seiya Masuda
Yoshiki Kamochi
Atsushi Nakamura
Yoshiki Kamochi
Atsushi Nakamura
Application Number:
JP2017515563A
Publication Date:
May 15, 2019
Filing Date:
April 27, 2016
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
B32B27/30; B32B27/08; B32B27/28; G03F7/038; G03F7/039; G03F7/11
Domestic Patent References:
| JP2014098889A | ||||
| JP2012168503A | ||||
| JP2014175135A | ||||
| JP2006058497A | ||||
| JP2007328234A |
Foreign References:
| WO2015025949A1 | ||||
| WO2007055119A1 |
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes