Title:
貼合せ基板製造装置及び貼合せ基板製造方法
Document Type and Number:
Japanese Patent JP4243499
Kind Code:
B2
Abstract:
A method of fabricating bonded substrates with fewer production defects. The method includes forming a frame of a seal on a surface of a first substrate; disposing first and second substrates into a process chamber, depressurizing the process chamber; moving at least one of the first and second substrates in such a way that the first and second substrates approach each other, computing a pressing load acting on the first and second substrates; stopping movement of the at least one of the first and second substrates when the computed pressing load reaches a target load; and setting a pressure in the process chamber back to atmospheric pressure.
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Inventors:
Koji Hashizume
Takanori Muramoto
Takuya Ohno
Yoshimasa Miyajima
Kazumasa Komatsu
Tsukasa Adachi
Katsuhiro Nakajima
Takanori Muramoto
Takuya Ohno
Yoshimasa Miyajima
Kazumasa Komatsu
Tsukasa Adachi
Katsuhiro Nakajima
Application Number:
JP2003059075A
Publication Date:
March 25, 2009
Filing Date:
March 05, 2003
Export Citation:
Assignee:
富士通株式会社
International Classes:
G02F1/13; G02F1/1339; G02F1/1333
Domestic Patent References:
| JP2002040398A | ||||
| JP2001005405A | ||||
| JP8106101A |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Makoto Onda
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