Title:
LAMINATING DAMPING SUBSTRATE AND DAMPING STRUCTURE FORMED BY LAMINATING DAMPING SUBSTRATES
Document Type and Number:
Japanese Patent JP3477188
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a damping structure dispensing with the connection of a resistor used in a conventional damping structure, having a simpler structure and capable of being subjected to various molding processings and to provide a laminating damping substrate constituting the damping structure.
SOLUTION: The laminating damping structure is manufactured from a piezoelectric ceramics material or piezoelectric polymeric material and a fiber reinforced plastic (FRP) composition having conductivity and a plurality of the damping substrates are laminated to constitute the first damping structure. Alternatively, the second damping structure is constituted by laminating at least one piezoelectric polymeric film or a piezoelectric ceramics thin film so as to position the same in a multilayered laminate formed by laminating a plurality of laminating FRP substrates having conductivity.
Inventors:
Toshio Tanimoto
Application Number:
JP2001315295A
Publication Date:
December 10, 2003
Filing Date:
October 12, 2001
Export Citation:
Assignee:
Toshio Tanimoto
Toshio Kimura
Toshio Kimura
International Classes:
B32B7/02; B32B18/00; B32B27/04; E04B1/82; E04C2/20; F16F15/00; F16F15/02; (IPC1-7): B32B18/00; B32B7/02; F16F15/02
Domestic Patent References:
| JP9216958A | ||||
| JP10132021A |
Other References:
【文献】米国特許5955822(US,A)
Attorney, Agent or Firm:
Fukushima Mitsuo (2 outside)
Previous Patent: WASTEWATER DECOLORING METHOD AND APPARATUS THEREFOR
Next Patent: DEVICE FOR CONTROLLING OPERATION OF MOTOR, AND ITS METHOD
Next Patent: DEVICE FOR CONTROLLING OPERATION OF MOTOR, AND ITS METHOD