Title:
貼合装置
Document Type and Number:
Japanese Patent JP6719295
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a pasting device capable of pasting at a position in a high precision in the order of ± 10 μm.SOLUTION: Provided is a pasting device comprising: a first carrier part 11 carrying the long first film 1 having a separator 3; the second carrier part 12 carrying the long second film 4; a half cut treatment part 13 forming sheet-shaped pieces 2 by the half cut of the first film; an adsorption holding part 14 adsorptively holding the sheet-shaped pieces; a peeling part 15 rotating the residual part other than the sheet-shaped pieces and the separator by a blade 16 to peel the sheet-shaped pieces from the separator; an adsorption operation control part 17 successively performing and controlling the first adsorption operation of adsorbing the sheet-shaped pieces at the adsorption holding part, an adsorption control operation of wholly or partially stopping or relaxing the adsorption operation and the second adsorption operation of adsorbing the sheet-shaped pieces again; a transfer mechanical part 18 transferring the sheet-shaped pieces from the peeling part to the pasting position 92 of the sheet-shaped pieces and the second film; and a pasting part 19 pasting the sheet-shaped pieces on the second film at the pasting position.SELECTED DRAWING: Figure 1
Inventors:
Kiyoshifuku
Nao Ikemoto
Masaki Adult
Nao Ikemoto
Masaki Adult
Application Number:
JP2016128022A
Publication Date:
July 08, 2020
Filing Date:
June 28, 2016
Export Citation:
Assignee:
NISSHA Co., Ltd.
International Classes:
B29C63/02; B65H37/04
Domestic Patent References:
| JP2013139108A | ||||
| JP2007160697A | ||||
| JP2010214838A | ||||
| JP2013512796A |
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Hiroshi Okabe
Mitsuo Wada
Mitsuo Tanaka
Hiroshi Okabe
Mitsuo Wada