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Title:
LAMINATION OF FLAT PLATE AND APPARATUS THEREFOR
Document Type and Number:
Japanese Patent JPH08209076
Kind Code:
A
Abstract:

PURPOSE: To provide a method for bonding two flat plates by a resin without including foam into a resin.

CONSTITUTION: An adhesive resin 3 such as ultraviolet curing resin is dropped respectively from resin-imparting parts 18 and 19 onto the upper faces of a flat microlens 22 (flat plate 1) and the glass substrate 23 (flat plate 2). Then, the glass substrate 23 is turned upside down to oppose the glass substrate 23 to the flat plate microlens 22 and an adhesive resin 3 attached in spot-like state to the glass substrate 23 is hung in cicles-like shape. The glass substrate 23 is lowered while keeping this state and brought into contact with the adhesive resin 3 on the upper face of the flat plate microlens 22. Further, the glass substrate 23 is lowered and the adhesive resin 3 is spread over whole face of attached face between the glass substrate 23 and the flat plate microlens 22 and, as necessary, the glass substrate 23 is sufficiently contacted with the flat plate microlens 22 under pressure. Finally, ultraviolet rays are irradiated from an ultraviolet lamp 24 to cure the adhesive resin 3.


Inventors:
SAITO ATSUSHI
AOYAMA SHIGERU
UCHIDA DAIDO
SHINOHARA MASAYUKI
Application Number:
JP3604695A
Publication Date:
August 13, 1996
Filing Date:
January 31, 1995
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
C09J5/10; C09J5/00; G02F1/1335; (IPC1-7): C09J5/10
Attorney, Agent or Firm:
Nakano Masafusa



 
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