To provide a magnetic acceleration large electric power sputtering method with which an ionization degree is increased, simultaneously, a positive charge is removed from the surface of a target, the heating of the target is prevented, and further, the utilization rate of a target material is increased.
In the large electric power pulsed magnetron sputtering method with which, in a process chamber, the composite discharge pulse of a certain sequence is generated, and sputtering gas is ionized, the composite discharge pulse includes a large electric power sputtering pulse (10) which is applied during a first pulse time (1) and a small electric power charge removal pulse (11) removing a charge on a target which is applied during a second pulse time (2), and the ratio (1/2) of the first pulse time (1) to the second pulse time (2) is 0.5 at the maximum.
| WO/2022/194377 | METHOD OF DEPOSITING MATERIAL ON A SUBSTRATE |
| JPS6476725 | FORMATION OF MULTILAYER FILM BY REACTIVE SPUTTERING |
ERKENS GEORG
MUELLER JUERGEN
VETTER JOERG
| JP2003022524A | 2003-01-24 | |||
| JP2003073814A | 2003-03-12 | |||
| JP2007162100A | 2007-06-28 | |||
| JPH0790573A | 1995-04-04 |
| WO2007121954A1 | 2007-11-01 | |||
| US20080135400A1 | 2008-06-12 |
Hideto Asamura
Hajime Asamura
Hayashi Zouzo
Kuniaki Shimizu
Kazuyuki Ohinata
Takayuki Hatanaka
Akira Iwami
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