Title:
LASER CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2016215251
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser cutting device capable of suppressing a temperature rise of a nozzle.SOLUTION: A laser cutting device comprises: an optical system for supplying a laser beam from a laser source; a lens barrel for holding the optical system; and a laser beam emitting part through which the laser beam passing the optical system is emitted. The laser cutting device further comprises: a nozzle emitting the laser beam in a state of facing an object to be cut; and a cooling member which has a first channel through which coolant supplied from a liquid supply device flows and cools the nozzle.SELECTED DRAWING: Figure 4
Inventors:
KUREYA MASAYUKI
WATANABE MASANARI
UENO DAIJI
YOSHIOKA ATSUSHI
TSURUGA SHIGENORI
YAMANISHI YOSHIMI
WATANABE MASANARI
UENO DAIJI
YOSHIOKA ATSUSHI
TSURUGA SHIGENORI
YAMANISHI YOSHIMI
Application Number:
JP2015104829A
Publication Date:
December 22, 2016
Filing Date:
May 22, 2015
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
B23K26/064; B23K26/00; B23K26/38
Domestic Patent References:
| JP2010194558A | 2010-09-09 | |||
| JPH07314169A | 1995-12-05 | |||
| JPH0230389A | 1990-01-31 | |||
| JPH0515989A | 1993-01-26 | |||
| JP2009166236A | 2009-07-30 | |||
| JPH05237682A | 1993-09-17 | |||
| JPS57177895A | 1982-11-01 |
Attorney, Agent or Firm:
Hiroaki Sakai
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