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Title:
LASER BEAM DRILLING METHOD
Document Type and Number:
Japanese Patent JP2008049398
Kind Code:
A
Abstract:

To provide a laser beam drilling method which can suppress the occurrence of deformation such as corrugation even in the case of drilling holes in a sheet member having low heat resistance at short intervals.

In the drilling method, after portions 14 to be drilled of a divided area n5 of the sheet member 2 are irradiated with laser beams, the portions 14 to be drilled of a divided area n4 adjoining the divided area n5 are skipped and the portions 14 to be drilled of a divided area n3 separate from the divided area n5 are irradiated with laser beams. The divided area n4 is irradiated with laser beams after irradiating divided areas n3, n1 and n6. When holes are drilled in the divided area n5, not only the divided area n5 but also the divided area n4 retain heat, so that no laser beam is emitted to the divided area n4 while the divided area n4 retain heat. After the temperature of the divided area n4 is lowered, it is irradiated with laser beams. This lessens the possibility of accumulating heat in the divided area n4 so that the deformation of the sheet member 2 is suppressed.


Inventors:
OTSUKA KAZUHISA
Application Number:
JP2007166577A
Publication Date:
March 06, 2008
Filing Date:
June 25, 2007
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B23K26/00; B23K26/382; B23K26/40; H05K3/00; B23K101/42
Domestic Patent References:
JP2001079677A2001-03-27
JP2002035976A2002-02-05
JP2003101188A2003-04-04
JP2003285177A2003-10-07
JP2003290957A2003-10-14
JP2004090062A2004-03-25
JP2004216385A2004-08-05
JP2004228534A2004-08-12
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Ryugo Akahori