Title:
LASER BEAM MACHINING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2014138956
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser beam machining method which can shorten takt time in laser beam machining.SOLUTION: A laser beam L is modulated by a reflective spatial light modulator. While the modulated laser beam L is focused on an object 1 to be machined, the laser beam L is moved relative to the object 1 to be machined. At this time, the laser beam L is modulated by the spatial light modulator so that reformed spots S and S are formed, with the laser beam L focused on two separate places along a direction D in which the laser beam L is moved on the object 1 to be machined.
Inventors:
NAKANO MAKOTO
INOUE TAKU
ITO HARUYASU
MATSUMOTO NAOYA
INOUE TAKU
ITO HARUYASU
MATSUMOTO NAOYA
Application Number:
JP2014060179A
Publication Date:
July 31, 2014
Filing Date:
March 24, 2014
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK
International Classes:
B23K26/53; B23K26/00; B23K26/064; B23K26/067; B23K26/08; B23K26/38; H01L21/301
Domestic Patent References:
| JP2006068762A | 2006-03-16 |
Foreign References:
| WO2005084874A1 | 2005-09-15 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Kenichi Shibayama
Arai Tohio
Yoshiki Kuroki
Kenichi Shibayama
Arai Tohio