To provide a laser beam machining method capable of removing contaminants produced by laser beam irradiation and stuck to a resin during machining, thereby obtaining a laser beam machining face having clean and desired shape in the case of machining a resin by laser beam irradiation.
A top board 35 made of resin is machined into the prescribed shape such as ink passage groove by the irradiation of excimer laser beam L, a basic wave and two hold higher harmonic wave of YAG laser beam L2, which are absorbed into contaminants (byproducts) produced by laser beam machining but is not absorbed into the resin, are simultaneously radiated. By the irradiation of the basic wave or two hold higher harmonic wave of YAG laser beam L2, the contaminants (byproducts) produced by the irradiation of the laser beam L and stuck to the resin is removed during laser beam machining, a clean and fine shape is machined with high precision.
GOTO AKIRA
HASEGAWA TOSHINORI
TAKIMOTO MASAFUMI
FURUKAWA MASAAKI
INABA MASAKI
SAITO AKIO
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