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Patent Searching and Data


Title:
LASER BEAM MACHINING SYSTEM FOR BENDING LINE
Document Type and Number:
Japanese Patent JP2004261823
Kind Code:
A
Abstract:

To improve the quality by making a workpiece curvilinearly bendable into an excellent shape regarding a laser beam machining system for a bending line in which a line for bending the workpiece is formed by laser irradiation.

The laser beam machining system for the bending line is for specifying the machining position and the machining depth for performing the laser beam machining to a prescribed number of bending lines different in depth corresponding to bending amounts R1, R2 during bending the workpiece 14 curvilinearly by half-cutting. It is so constituted that the machining depth of the bending line R1, in which the bending amount of the workpiece 14 is large, is formed large, and the machining depth of the corresponding bending line R2, in which the bending amount is small, is formed small.


Inventors:
SUZUKI HIDEKI
Application Number:
JP2003052644A
Publication Date:
September 24, 2004
Filing Date:
February 28, 2003
Export Citation:
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Assignee:
TOPPAN FORMS CO LTD
International Classes:
B21D11/08; B23K26/00; B23K26/364; (IPC1-7): B23K26/00; B21D11/08
Attorney, Agent or Firm:
▲高▼橋 寛