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Title:
LASER BEAM MACHINING SYSTEM AND LASER BEAM MACHINING METHOD
Document Type and Number:
Japanese Patent JP2003103390
Kind Code:
A
Abstract:

To provide a laser beam machining system capable of suppressing dividing ratio accuracy low not depending on the reflection rate of a reflection plate, a transmission rate of a half mirror, a solid difference of the laser beam machining system, etc., despite the simple constitution, and obtaining stable dividing ratio accuracy in terms of an age-base, in the laser beam machining system provided with a multiple splitting optical path.

A laser beam machining system 100, wherein, in machining a predetermined work 5 by splitting a laser beam 2 oscillated from one laser oscillator 1 into a plurality of optical paths into 4-1, 4-2, 4-3 using a splitting means 3, a return polarization canceling means 8 canceling a return polarization of a laser return beam 7 is provided in a space optical path 6 formed between the laser oscillator 1 and the laser beam splitting means 3.


Inventors:
MORITA HIROYUKI
NAKAJIMA TORU
ARIGA SATORU
Application Number:
JP2001294354A
Publication Date:
April 08, 2003
Filing Date:
September 26, 2001
Export Citation:
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Assignee:
NEC CORP
International Classes:
G02B27/28; B23K26/064; B23K26/067; B23K26/21; H01S3/00; H01S3/13; (IPC1-7): B23K26/06; B23K26/00; B23K26/08; G02B27/28; H01S3/00; H01S3/13
Attorney, Agent or Firm:
Yasuyuki Hata