To provide a laser bonding process of members, which can assure mutual bonding of the members regardless of their materials.
The process is characterized as follows. A mutually piled up first member 11 consists of an acrylic material which transmits a semiconductor laser light, and a second member 12 consists of tin. The interface of the second member 12 is made into a sandpaper-roughened concavo-convex interface 12a with a density in stria counting of 0.03[/m] or higher, and the laser light absorption factor of the interface 12a is made 17% or higher. The semiconductor laser light is absorbed in the interface 12a of the member 2 resulting in local melting or softening of the acrylic material in the vicinity of the interface 12a, by irradiating the semiconductor laser light on the boundary of the first and second members 11 and 12. A firm bonding is formed between both members by an anchor effect due to, adhering and biting into the concavo-convexity of interface 12a, of the melting or softening acrylic resin.
NAKAMURA TAKASHI
HASEGAWA TATSUYA
