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Title:
LASER CUTTER
Document Type and Number:
Japanese Patent JP2014076477
Kind Code:
A
Abstract:

To suppress equipment cost, to achieve space saving, and to increase maintainability.

A laser cutter 10 comprises: a support stage 20 which is installed above a base 11 with a distance and has a support surface 20a supporting an object to be processed W; and a laser head 14 which is relatively movable with respect to the support stage 20 and emits a laser beam toward the support surface 20a of the support stage 20. The support stage 20 has a plurality of through holes 25 which penetrate the support surface 20a, and an opposite surface 20b which faces the support surface 20a. A reflective member 30 may be provided which is installed so as to face the opposite surface 20b of the support stage 20.


Inventors:
KANEOKA KOHEI
WATANABE MASANARI
SENNYU KATSUYA
Application Number:
JP2012226274A
Publication Date:
May 01, 2014
Filing Date:
October 11, 2012
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
B23K26/10; B23K26/38
Domestic Patent References:
JP2002273594A2002-09-25
JPH091375A1997-01-07
JP2002248593A2002-09-03
JPH10328875A1998-12-15
JPS5992193A1984-05-28
JP2012110945A2012-06-14
JPH08290284A1996-11-05
JP2002273594A2002-09-25
JPH091375A1997-01-07
Foreign References:
WO2008114010A12008-09-25
Attorney, Agent or Firm:
Noriharu Fujita
Kunio Ueda



 
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