レーザ切断装置およびレーザ溶接装置

Japanese Patent JP5254329

B2

A method of forming plastic containers is disclosed. The method includes: providing a support platen having a cut outline and a groove outline in the top surface of the support platen and a plurality of exhaust ports in the bottom of the groove, where a plurality of spaced perforations are in the top surface of the support platen, where the groove is configured to define a cut outline; positioning a first film on the top surface of the support platen; providing a laser to cut the first film along the cut outline of the top surface of the support platen; providing a second film on top of the first film; connecting the plurality of exhaust ports and the plurality of space perforations to a vacuum source to secure the first film to the support platen; directing a jet of gas onto the second film at the to maintain the second sheet in contact with the first sheet at a seam during welding concentric with a beam from the laser to weld the first film and the second film; moving the laser and the support platen relative to each other to weld the first film and the second film along a seam outline; and providing the laser to cut the first film and the second film along the cut outline to provide a trimmed bag.

JP2015160334	METHOD OF JOINING RESIN MEMBER AND METHOD OF MANUFACTURING WELL CHIP FOR INSPECTION
WO/2013/031505	WELDED BODY MANUFACTURING METHOD
JPS60137585	LASER CUTTING METHOD

Shin, Vijay
Michael Sanders

JP2010514978A

August 07, 2013

June 18, 2008

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GE Healthcare Bioscience Bioprocess Corporation

B29C65/16; B23K26/00; B23K26/10; B23K26/14; B23K26/32; B23K26/40; B29K23/00; B29K27/12

JP2010505660A
JP2005211957A
JP2003205550A
JP2003251699A
JP4059339A
JP53014772A

Shinjiro Ono
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Yamazaki Kosaku

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