LASER CUTTING METHOD AND APPARATUS

Title:

LASER CUTTING METHOD AND APPARATUS

Document Type and Number:

Japanese Patent JP2004066745

Kind Code:

A

Abstract:

To provide a laser cutting method and apparatus which can provide a desired irradiation shape and intensity distribution of a cutting irradiation beam by a simple constitution.

In this method, cracks 30, 31 formed in a cutting origin of a substrate 3 are directed along a predetermined cutting line 40 by utilizing thermal stress created upon laser beam irradiation to cut the substrate 3. An incident beam 10 is diffracted by a diffraction optical element 2 to generate an irradiation beam 20 having predetermined irradiation shape and strength distribution. The substrate 3 is irradiated with the generated irradiation beam 20. One example of the irradiation beam 20 is a strip beam having substantially uniform intensity distribution along the predetermined cutting line 40.

Inventors:

AMAKO ATSUSHI
YOSHIMURA KAZUTO

Application Number:

JP2002232017A

Publication Date:

March 04, 2004

Filing Date:

August 08, 2002

Export Citation:

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Assignee:

SEIKO EPSON CORP

International Classes:

G02B5/18; B23K26/06; B23K26/073; B23K26/38; B23K26/40; B28D5/00; C03B33/09; H01S3/00; H01S3/10; H01S3/101; (IPC1-7): B28D5/00; B23K26/00; B23K26/06; C03B33/09; H01S3/00; H01S3/10; H01S3/101

Attorney, Agent or Firm:

Souji Sasaki
Hisao Kobayashi
Saburo Kimura
Noboru Omura

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