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Title:
LASER CUTTING METHOD AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JPH1110382
Kind Code:
A
Abstract:

To provide a laser cutting method and device capable of preventing adverse effect on the cutting section due to self-burning or the like particularly in high speed cutting.

In this laser cutting method for executing the cutting while a gas 23, 24 is injected to a material 25 to be cut from plural nozzles 30, 31 arranged annularly or side by side at and near the cutting point 26 irradiated with a laser beam 22 for cutting, oxygen density is varied in the gas 23, 24 injected from at least one of the nozzles 30, 31, with the distribution of the oxygen density adjusted in the range of a few mm or about from the cutting point 26, thereby improving the cutting quality.


Inventors:
NAGATA YOZO
NAGABORI MASAYUKI
Application Number:
JP16478197A
Publication Date:
January 19, 1999
Filing Date:
June 20, 1997
Export Citation:
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Assignee:
TANAKA SEISAKUSHO KK
International Classes:
B23K26/064; B23K26/12; B23K26/14; (IPC1-7): B23K26/12; B23K26/06; B23K26/14
Domestic Patent References:
JPS5822783U1983-02-12
Attorney, Agent or Firm:
志賀 正武 (外2名)