Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
レーザ切断方法、および、レーザ切断装置
Document Type and Number:
Japanese Patent JP7272041
Kind Code:
B2
Abstract:
To provide a technology capable of improving quality of a cut component, in a laser cutting method.SOLUTION: A laser cutting method includes an arrangement step for arranging a slit from/to which gas is injected to/sucked from a sheet member in transit in a direction non-parallel to cut projected line of the sheet member, and a cutting step for injecting/sucking gas from/to the slit, while irradiating a position where the slit is overlapped by the cut projected line with a laser beam.SELECTED DRAWING: Figure 2

Inventors:
Masatoshi Yonemura
Tadashi Oshima
Gen Kato
Application Number:
JP2019056133A
Publication Date:
May 12, 2023
Filing Date:
March 25, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Toyota Central R & D Labs.
International Classes:
B23K26/38; B23K26/142; B23K26/16
Domestic Patent References:
JP2014210277A
JP9327786A
JP2002239775A
JP2001259869A
JP2008254029A
Attorney, Agent or Firm:
Junya Tanabe



 
Previous Patent: wearable display

Next Patent: PAPER SHEETS DISCRIMINATING DEVICE