Title:
LASER DICING APPARATUS AND LASER DICING METHOD
Document Type and Number:
Japanese Patent JP2015170697
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser dicing apparatus and a laser dicing method capable of inspecting formation states (existence of a defective portion in a modified region, a position of the defective portion, etc.) of the modified region due to irradiation of a laser beam by observation of a rear face of the wafer without increasing processing time.SOLUTION: A wafer W is sucked and held to a transparent chuck table 12 and a laser beam from a laser head 50 is applied to the wafer along a processing line. Thereby, a modified region for dividing the wafer W on the processing line is formed in the wafer W. On the other hand, a microscope 80 is arranged on the rear face side of the chuck table 12 and the rear face of the wafer W on a position along the processing line is photographed by the microscope 80. Whether a crack extended from the modified region to the rear face of the wafer W appears or not is determined on the basis of an image obtained by the photographing to determine the formation states of the modified region.
Inventors:
SHIMIZU TASUKU
Application Number:
JP2014043982A
Publication Date:
September 28, 2015
Filing Date:
March 06, 2014
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
H01L21/301; B23K26/00; B23K26/08; B23K26/53
Domestic Patent References:
| JP2015050226A | 2015-03-16 | |||
| JP2012199374A | 2012-10-18 | |||
| JP2010082644A | 2010-04-15 |
Foreign References:
| US8361828B1 | 2013-01-29 |
Attorney, Agent or Firm:
Kenzo Matsuura
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