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Title:
Laser dicing method
Document Type and Number:
Japanese Patent JP6055494
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a protection film composition for laser dicing, containing (A) a water-soluble polymer and (B) a crosslinking agent.SOLUTION: The weight average molecular weight (Mw) of (A) a water-soluble polymer is 10,000-150,000, and, specifically, is favorable to be 12,500-125,000. An addition of a crosslinking agent causes a crosslinking reaction between functional groups of the water-soluble polymer, and thereby thermal stability of the water-soluble polymer can be improved. Consequently, by applying a composition containing the water-soluble polymer and a crosslinking agent to a laser dicing process, cut-chips hardly adhere and thereby a base material can be protected, and also the problem of contamination of the base material can be reduced. In addition, an improvement in thermal stability of a protection film exerts such effects that the stability of the protection film is improved, the protection film is hardly deteriorated, and cutting lines are made flat, in dicing.SELECTED DRAWING: Figure 1

Inventors:
TSAI,YUNG-CHI
Somitsu
Kakei Hayashi
Application Number:
JP2015013307A
Publication Date:
December 27, 2016
Filing Date:
January 27, 2015
Export Citation:
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Assignee:
Gotachi Technology Co., Ltd.
International Classes:
C09J7/02; H01L21/301; C09J11/06; C09J201/00
Domestic Patent References:
JP5563341B2
JP2008515668A
JP4053656B2
JP2014172932A
JP2010192867A
JP2010165963A
Foreign References:
WO2012173758A2
WO2012173768A2
Attorney, Agent or Firm:
Hiroshi Masaki
Yuko Mikami
Tadashi Fujikawa



 
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