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Title:
LASER JOINING METHOD OF RESIN MEMBER, AND LASER JOINED BODY OF RESIN MEMBER
Document Type and Number:
Japanese Patent JP2011161651
Kind Code:
A
Abstract:

To provide a laser joining method of a resin member providing a joined structure with a high join strength when laser-joining the resin member of a high heat resistance by using an optical absorbent, and to provide a laser joined body of the resin member.

In the laser joining method of a resin member, two or more resin members are brought into contact with each other, and irradiating the optical absorbent disposed near the contact face with laser beam to melt-weld the resin member. At least any one of the resin members is a thermoplastic resin having a glass transition point or a melting point of 300°C or higher, the optical absorbent has a weight reduction of less than 40% measured by using a differential thermal balance by heating up to 350°C.


Inventors:
MATSUO NAOYUKI
SHIMODA MAYU
KIBE RYUTA
Application Number:
JP2010023460A
Publication Date:
August 25, 2011
Filing Date:
February 04, 2010
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
B29C65/16; B29K77/00; B29K79/00
Domestic Patent References:
JP2007532349A2007-11-15
Attorney, Agent or Firm:
Noboru Fujimoto
Seiichi Yakumaru
Hiroaki Nakatani
Yuichi Koyama



 
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