Title:
LASER LIGHT IRRADIATION APPARATUS AND LASER LIGHT IRRADIATION METHOD
Document Type and Number:
Japanese Patent JP2023102663
Kind Code:
A
Abstract:
To easily set a focus of laser light.SOLUTION: A laser light irradiation apparatus 1 comprises: a laser light irradiation unit 20 which irradiates a wafer 200 with laser light 21; a first movement unit which moves a holding table 10; a second movement unit 50 which changes a distance between the laser light irradiation unit 20 and the wafer 200; a light reception unit 70 which receives plasma light 21-1; and a control unit 100. The control unit 100 comprises: a commanding part which issues a command for irradiating the wafer 200 with the laser light 21 by moving the holding table 10 while changing the distance; an information acquisition part which acquires the light intensity of the plasma light 21-1 received by the light reception unit 70; a recording part which records the distance and the light intensity in association with each other; and a focus detection part which detects the distance at which the focus 27 of the laser light 21 is brought to the front surface 202 of the wafer 200 according to the light intensity recorded in the recording part.SELECTED DRAWING: Figure 3
Inventors:
HONGO TOMOYUKI
Application Number:
JP2022003310A
Publication Date:
July 25, 2023
Filing Date:
January 12, 2022
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23K26/03; B23K26/00; B23K26/364; H01L21/301
Attorney, Agent or Firm:
Sakai International Patent Office