LASER MACHINING APPARATUS

Japanese Patent JP2008060139

A

To provide a configuration capable of frequency-converting a pulse laser beam in which the pulse width per pulse is in a range not more than a picosecond, while suppressing noise light.

The laser machining apparatus 1 is provided with a laser emitter 11 for oscillating at a predetermined first frequency and outputting a pulse laser beam in which the pulse width per pulse is in the range not more than pico/sec; a pulse picker 14 for converting a pulse laser beam to be emitted from the laser emitter 11 into a second frequency lower than a first frequency of the laser emitter 11, and outputting the converted laser beam; a main amplifier 13 for amplifying the pulse laser beam emitted from the pulse picker 14; and a convergence lens 22 for allowing the pulse laser beam amplified in the main amplifier 13 to converge, and irradiating a workpiece W with the pulse laser beam. Further, an oversaturation absorbing body is disposed on an optical path of the pulse laser beam in a poststage side of the pulse picker 14.

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August 29, 2006

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SUNX LTD

H01S3/10; B23K26/00; B23K26/064; B23K26/073; G02F1/35

JPH09252282A	1997-09-22
JP2000031905A	2000-01-28
JP2005152960A	2005-06-16
JPH09298333A	1997-11-18
JP2000101175A	2000-04-07
JP2006049491A	2006-02-16
JP2002031824A	2002-01-31
JPH07221706A	1995-08-18

US20050226286A1

2005-10-13

Arisa Ushiro
Jiro Murakami
Keiko Mizusawa

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