Title:
LASER MACHINING DEVICE, DEVICE FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3023320
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a laser machining device capable of accurately reading a positioning mark and a device and a method of manufacturing a multilayer printed wiring board.
SOLUTION: Positioning marks 11a and an inter-layer insulating material layer are formed to the multilayer printed wiring board 10, and placed on an X-Y table 80. A silhouette formed by the light from an LED 88 buried to the X-Y table 80 being shaded by the positioning marks 11a of the mutilayer printed wiring board 10 is read by a camera 90, and the place of the positioning marks 11a of the multilayer printed wiring board 10 are measured. Data for driving a galvanohead 70 and the X-Y table 80 are prepared from positional and machining data measured, the X-Y table 80 and the galvanohead 70 are controlled, the multilayer printed wiring board 10 is irradiated with laser beans, and an interlayer resin layer is removed and holes are formed.
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Inventors:
Yasuji Hiramatsu
Application Number:
JP35891196A
Publication Date:
March 21, 2000
Filing Date:
December 27, 1996
Export Citation:
Assignee:
IBIDEN Co., Ltd.
International Classes:
B23K26/00; B23K26/08; H05K3/00; H05K3/46; (IPC1-7): H05K3/46; B23K26/00; B23K26/08; H05K3/00
Domestic Patent References:
| JP7308791A | ||||
| JP8153976A | ||||
| JP57101907A | ||||
| JP3233998A | ||||
| JP473996A | ||||
| JP9308978A |
Attorney, Agent or Firm:
Akito Tagashita (1 person outside)