Title:
レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機
Document Type and Number:
Japanese Patent JP7066368
Kind Code:
B2
Abstract:
Provided is a control device of a laser processing machine capable of reducing a deviation between an incident position of a laser beam after calibration of a beam scanning machine and a target incident position. A control device controls the laser processing machine having the beam scanning machine for moving the incident position of a pulsed laser beam on a surface of an object to be processed by scanning the pulsed laser beam output from a laser light source. The control device has a function of controlling an output timing of the pulsed laser beam from the laser light source, a function of instructing the beam scanning machine to the target position at which the pulsed laser beam is incident, and a function of performing calibration of the beam scanning machine on the basis of the pulse frequency at the time of actual processing.
Inventors:
Hiroshi Ishihara
Application Number:
JP2017204857A
Publication Date:
May 13, 2022
Filing Date:
October 24, 2017
Export Citation:
Assignee:
Sumitomo Heavy Industries Ltd.
International Classes:
B23K26/00; B23K26/082
Domestic Patent References:
| JP2004358550A | ||||
| JP2010099674A | ||||
| JP2011056521A | ||||
| JP2011519312A | ||||
| JP1095889A | ||||
| JP2016172282A | ||||
| JP2006263810A |
Foreign References:
| WO2015198398A1 |
Attorney, Agent or Firm:
Mikio Kuruyama