Title:
レーザー加工装置及びレーザー加工方法
Document Type and Number:
Japanese Patent JP7308396
Kind Code:
B2
Abstract:
To provide a laser processing device and a laser processing method capable of precisely forming a laser processing area on a desirable position of an inner part of a workpiece.SOLUTION: A laser processing device includes an area presetting part 57 which divides a workpiece into a first area and a second area, a profile gain part 58 for gaining a first profile which exhibits a rugged shape of a principal plane of the workpiece of an objective line and a second profile which exhibits the rugged shape of the principal plane of the workpiece of a line just before the objective line, a reference profile calculation part 62 which calculates a reference profile provided by smoothing the second profile and an AF control part 56 which controls a laser processing area formation position based on the reference profile on a first area and controls the laser processing area formation position based on the first profile on a second area, when forming the laser processing area along the objective line.SELECTED DRAWING: Figure 3
Inventors:
Takao Shioya
Application Number:
JP2019043889A
Publication Date:
July 14, 2023
Filing Date:
March 11, 2019
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B23K26/046; B23K26/03; B23K26/53; H01L21/301
Domestic Patent References:
| JP2009297773A | ||||
| JP2005193284A |
Foreign References:
| WO2009078231A1 | ||||
| WO2018092669A1 |
Attorney, Agent or Firm:
Kenzo Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura