To provide a laser processing apparatus capable of executing centering work of laser beam in a short period of time without depending on skill degree of an operator.
The laser processing apparatus is configured of a laser oscillator 1 for generating the laser beam 2, a processing lens 4 for condensing the laser beam 2 on a workpiece W, a processing nozzle 11 for passing the condensed laser beam 2 and supplying assist gas toward the workpiece W, a processing head 5 for supporting the processing lens 4 and the processing nozzle 11, a light sensor 6 for detecting spatial distribution of light emitted from the irradiation part of the workpiece W during the irradiation of the laser beam 2, and a signal processing device 9 for measuring the position of the laser beam 2 to the center of the nozzle based on a signal from the light sensors 6.
SEGUCHI MASAKI
| JPH0417991A | 1992-01-22 | |||
| JPH03234385A | 1991-10-18 | |||
| JPH10249566A | 1998-09-22 | |||
| JP2005254314A | 2005-09-22 |
Mitsuo Tanaka
Mikio Takeuchi
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