Title:
レーザ加工装置、レーザ加工方法、および補正データ生成方法
Document Type and Number:
Japanese Patent JP7285465
Kind Code:
B2
Abstract:
To enable a depth of a key hole to be accurately measured.SOLUTION: A laser processing device comprises: a first mirror that varies paths of a laser beam for processing and a measuring beam; a second mirror that varies an angle of incidence of the measuring beam into the first mirror; a beam shift mechanism that varies a position of incidence of the measuring beam into the first mirror; a lens that collects the laser beam for processing and the measuring beam into a processing point; a control part that controls the first mirror, the second mirror and the beam shift mechanism on the basis of corrected data for processing; and a measurement processing part that measures a depth of a key hole generated in the processing point. The corrected data for processing are data corrected so that deviations on a surface of a work-piece at an arrival position of at least either of the laser beam for processing and the measuring beam caused by a chromatic aberration of the lens and deviations of an angle of the key hole and an angle of the measuring beam can be eliminated.SELECTED DRAWING: Figure 3
Inventors:
Jun Yokoyama
Yohei Takechi
Yohei Takechi
Application Number:
JP2019151157A
Publication Date:
June 02, 2023
Filing Date:
August 21, 2019
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
B23K26/00; B23K26/21; G01B11/22
Domestic Patent References:
| JP2015196169A | ||||
| JP2018153842A | ||||
| JP2018501964A | ||||
| JP2016538134A |
Foreign References:
| US20160356595 |
Attorney, Agent or Firm:
Patent Attorney Corporation Washida International Patent Office