Title:
LASER PROCESSING DEVICE, PROCESSING PATTERN ADJUSTING METHOD FOR LASER PROCESSING DEVICE, PROCESSING PATTERN ADJUSTING PROGRAM FOR LASER PROCESSING DEVICE, COMPUTER READABLE RECORDING MEDIUM, AND RECORDING APPARATUS
Document Type and Number:
Japanese Patent JP2018001236
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To allow operation parameters to be adjusted automatically or semi-automatically by acquiring results of processing without performing actual test processing.SOLUTION: The laser processing device comprises: a laser beam control portion 4 which controls a laser beam scanning portion 9 on the basis of processing segment line data generated by an expanded data generating portion in a state where a laser beam LB is not emitted to the outside; a scanning angle detecting portion 72 which detects a scanning angle of the laser beam scanning portion 9; a locus data generating portion 80X which generates locus data indicating a second locus ST through which the laser beam LB is assumed to pass during actual laser processing, on the basis of the scanning angle of the laser beam scanning portion 9 and timing for emitting the laser beam LB; a locus displaying control portion 80Y which performs control so that the second locus ST is displayed on a display portion 82; a processing defect extracting portion 80W which extracts as a processing defect position a position corresponding to processing defect; and an operation parameter adjusting portion 80Z which adjusts operation parameters defining operation of the laser beam scanning portion 9.SELECTED DRAWING: Figure 9
Inventors:
SUZUKI TAKEYUKI
YAMAKAWA HIDEKI
NAKAGAWA HIDEHITO
YAMAKAWA HIDEKI
NAKAGAWA HIDEHITO
Application Number:
JP2016132876A
Publication Date:
January 11, 2018
Filing Date:
July 04, 2016
Export Citation:
Assignee:
KEYENCE CO LTD
International Classes:
B23K26/082; B23K26/00; G02B26/10
Attorney, Agent or Firm:
Yuki Ogasawara