Title:
レーザ加工装置及びレーザ加工方法
Document Type and Number:
Japanese Patent JP4527567
Kind Code:
B2
Inventors:
Satoshi Ando
Takashi Yu
Akira Matsuno
Takashi Yu
Akira Matsuno
Application Number:
JP2005056710A
Publication Date:
August 18, 2010
Filing Date:
March 01, 2005
Export Citation:
Assignee:
Feton Co., Ltd.
International Classes:
B23K26/06; B23K26/08
Domestic Patent References:
| JP4333387A | ||||
| JP10034365A | ||||
| JP2004001084A |
Attorney, Agent or Firm:
Atsushi Akiyama
Yuriko Shirota
Yuriko Shirota