Title:
レーザ加工装置及びレーザ加工方法
Document Type and Number:
Japanese Patent JP7370293
Kind Code:
B2
Abstract:
A laser processing apparatus includes: a work support portion which supports the work and forms a closed space between the work and the work support portion; pads which are movable upward and downward inside the closed space and include upper surfaces respectively coming into contact with regions obtained by dividing a processing object region having the through-holes formed in the work to surround the region of the work over one circle when the pads move upward; a drive unit which drives the pads to move forward and backward between a state in which the pad is in contact with the work and a state in which the pad is separated from the work; a gas supply unit which supplies a gas into the closed space; and clamps which contact the work supported by the work support portion on inner circumferential surfaces and outer circumferential surfaces from above over one circle.
Inventors:
Takashi Kobayashi
Narihiko Ohkubo
Kenichi Fukami
Seiichi Koji
Kenji Sugai
Narihiko Ohkubo
Kenichi Fukami
Seiichi Koji
Kenji Sugai
Application Number:
JP2020064222A
Publication Date:
October 27, 2023
Filing Date:
March 31, 2020
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
B23K26/382; B23K26/142; B23K26/70
Domestic Patent References:
| JP2011206791A | ||||
| JP2011235292A |
Foreign References:
| WO2009001497A1 | ||||
| WO2009091020A1 |
Attorney, Agent or Firm:
Deloitte Tohmatsu Patent Attorneys Corporation