レーザー加工装置

Japanese Patent JP5220121

B2

Laser processing equipment is provided. The laser beam processing equipment includes a laser resonator, an optical system, a chamber, a reflector, and a laser beam aligning unit. The laser resonator resonates a laser beam. The optical system converts the laser beam resonated by the laser resonator to have an energy density of a beam profile with a predetermined beam width. The laser beam converted by the optical system is radiated onto a processing object disposed in the chamber. The reflector is disposed between the laser resonator and the chamber to reflect the laser beam. The laser beam aligning unit aligns the laser beam radiated into the chamber. The laser beam aligning unit includes an aligning member installed between the reflector and the processing object and disposed in a travel path of the laser beam. The aligning member defines a through-hole that is greater in area than a cross-section of the laser beam to enable the laser beam to pass therethrough. The driver drives the reflector to control the travel path of the laser beam reflected by the reflector. The controller controls the driver to control a distance between a center of the laser beam and a center of the through-hole, based on the laser beam detected as passing through the through-hole of the aligning member.

Kim Hyonjun
Kim, Dajin
Homme, Sun-fan
Lee, Gwang-jae

JP2010533971A

June 26, 2013

November 18, 2008

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Cornic Systems Company Limited

H01S3/00; B23K26/00; B23K26/073; H01S3/10

JP9271971A
JP7080671A
JP2001284281A
JP52015107Y1
JP60130935A
JP2006253671A

Tadahiko Ito
Shinsuke Onuki
Tadashige Ito

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