Title:
レーザー加工装置
Document Type and Number:
Japanese Patent JP7339031
Kind Code:
B2
Abstract:
A laser processing apparatus includes a chuck table for holding a workpiece, a laser beam applying unit for applying a pulsed laser beam to the workpiece held by the chuck table while positioning spots of the pulsed laser beam on the workpiece, thereby processing the workpiece with the pulsed laser beam, and a control unit for controlling operation of the laser beam applying unit. The laser beam applying unit includes a laser oscillator for oscillating pulsed laser to emit a pulsed laser beam, a decimator for decimating pulses of the pulsed laser beam to adjust a repetitive frequency thereof, a scanner for scanning the spots of the pulsed laser beam over the workpiece at predetermined intervals, and an fθ lens for focusing the pulsed laser beam.
Inventors:
Yoji Mori
Application Number:
JP2019120713A
Publication Date:
September 05, 2023
Filing Date:
June 28, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B23K26/0622; B23K26/53; H01L21/304
Domestic Patent References:
| JP2013119106A | ||||
| JP2013021225A | ||||
| JP2013520848A |
Attorney, Agent or Firm:
Atago Patent Attorneys Office
Naozumi Ono
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko
Naozumi Ono
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko
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