To provide a laser processing machine capable of protecting an optical path component from reflected light of a laser beam.
In a laser processing machine for irradiating a workpiece W with a laser beam La emitted from a laser oscillator 21 by propagating the laser beam along an optical path, the laser processing machine includes a bellows 2 for protecting the surroundings of the optical path by enclosing the circumference of the optical path along the optical axis of the laser beam, an aperture 1 arranged at a low side of the optical path relative to the bellows 2 and letting the laser beam La pass therethrough and intercepting the reflected light of the laser beam La reflected from the workpiece W, a temperature switch 3 for detecting the reflected light irradiated to the aperture 1, and a control section 50 for controlling motions of a laser oscillator 21 on the basis of detected results of the reflected light detected with the temperature switch 3. The aperture 1 is formed of a plate-shaped member, and is arranged so as to make a primary surface of the plate-shaped member face a direction perpendicular to the optical axis of the laser beam La.
JP4216536 | Laser / punch compound processing machine |
WO/1987/005849 | WORK HEAD DEVICE |
WO/2017/055057 | METHOD FOR PRODUCING AN ELECTRODE COMPOSITE |
YOKOI SHIGERU