Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LASER PROCESSING MACHINE
Document Type and Number:
Japanese Patent JP2009184010
Kind Code:
A
Abstract:

To provide a laser processing machine having a cutting guide function.

The laser processing machine 10 includes a laser mechanism 20, a guide unit 30 and an ultrasonic means 40. The laser mechanism 20 is can generating a laser beam which irradiates a workpiece 12 along a path. The guide unit 30 is arranged adjacent to the laser mechanism 20. The ultrasonic means 40 is cangenerating an ultrasonic wave to be transferred to the workpiece 12 along the path by the guide unit 30. By means of the double-processing effect of the ultrasonic wave and the laser beam, the invention achieves the objects of high cutting precision, excellent product quality and fast processing speed.


Inventors:
KAKU KARYU
CHEN YAN-HUA
Application Number:
JP2008038297A
Publication Date:
August 20, 2009
Filing Date:
February 20, 2008
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
CONTREL TECHNOLOGY CO LTD
International Classes:
B23K26/16; B23K26/38; B23K26/40; C03B33/09; G02F1/13; B23K101/40
Domestic Patent References:
JP2004155159A2004-06-03
JPH06124935A1994-05-06
JPH10291084A1998-11-04
JP2005088068A2005-04-07
JPH08118052A1996-05-14
Attorney, Agent or Firm:
Masaki Hattori