レーザー加工方法 - Disco Co., Ltd.

Title:

レーザー加工方法

Document Type and Number:

Japanese Patent JP7420508

Kind Code:

B2

Abstract:

Provided is a laser processing method capable of preventing corners of a device chip from chipping. The laser processing method includes a first modified layer formation step of forming a modified layer (16) in a plurality of first division schedule lines (4a) extending in a first direction (D1), and a second modified layer formation step of forming a modified layer (22) in a plurality of second division schedule lines (4b) extending in a second direction (D2) intersecting the first direction (D1). In the second modified layer formation step, the modified layer (22) is formed by irradiating from the central region (18) of the second division schedule line (4b) specified by an intersection (C1) of the second division schedule line (4b) and the first division schedule line (4a) on which the modified layer (16) is formed already and an adjoining intersection (C2) to the neighborhood of respective intersections (C1, C2) with a laser beam (LB).

Inventors:

Masaru Nakamura

Application Number:

JP2019151333A

Publication Date:

January 23, 2024

Filing Date:

August 21, 2019

Export Citation:

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