Title:
LASER PROCESSING METHOD
Document Type and Number:
Japanese Patent JPS59178748
Kind Code:
A
Abstract:
PURPOSE:To enable to relieve an integrated circuit of defects with high yield by a method wherein the following processing is performed while measuring the characteristic of said circuit, when the wirings at a specific part of said circuit are connected or cut by irradiating this part with a laser, and then the laser processing condition is varied so as to obtain desired characteristic. CONSTITUTION:The characteristic of a chip 11 is measured by making probers 13a and 13b connected to a tester 14 abut against the pads 12a and 12b of the chip low resistant polycrystalline Si wirings 3 and 4, a high resistant polycrystalline Si wiring 5, and the Al electrode pads 12a and 12b are formed. At this time, the laser light 7 from a laser oscillator 15 is passed through a laser light intensity adjuster 18 controlled by a controlling device 16 and then condensed by means of an objective lans 19, resulting in irradiation on the wiring of the light. Thus constructed, the output of the laser light 7 is adjusted by rotating a deflection plate provided in the adjuster 18, and then these wirings are connected or cut so that the resistance value obtained by the tester 14 becomes a desired value.
Inventors:
HONGOU MIKIO
MIYAUCHI TAKEOKI
KAWANABE TAKAO
INOUE MORIO
MIYAUCHI TAKEOKI
KAWANABE TAKAO
INOUE MORIO
Application Number:
JP5236583A
Publication Date:
October 11, 1984
Filing Date:
March 30, 1983
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/3205; H01L21/82; H01L23/525; H01L27/10; (IPC1-7): H01L21/88; H01L27/10
Attorney, Agent or Firm:
Katsuo Ogawa