Title:
レーザはんだ付け装置
Document Type and Number:
Japanese Patent JP5294916
Kind Code:
B2
Abstract:
By irradiating laser light 20 obliquely onto a substrate 6, the laser soldering apparatus reduces the laser light passing through an insertion hole 61a in the substrate 6 and prevents damage to low-heat-resistance portions of a component 62 disposed on the rear surface side of the substrate 6. Moreover, the substrate 6 can be observed from a normal direction with a camera 23. Therefore, even if the insertion hole 61 for inserting a component lead or the like is provided in the substrate 6, the laser light does not leak out to the side of a component mounting surface 17 of the substrate 6.
Inventors:
Ide Nakai
Masahiro Mori
Yukio Nishikawa
Masahiro Mori
Yukio Nishikawa
Application Number:
JP2009033773A
Publication Date:
September 18, 2013
Filing Date:
February 17, 2009
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H05K3/34; B23K1/00; B23K1/005; B23K26/04; B23K26/21; B23K101/42
Domestic Patent References:
| JP62169769U | ||||
| JP62282773A | ||||
| JP6013746A | ||||
| JP4237557A | ||||
| JP62275571A | ||||
| JP2001523585A | ||||
| JP4026666U | ||||
| JP5235538A | ||||
| JP3198976A | ||||
| JP63160780A | ||||
| JP62165071U | ||||
| JP2008168333A | ||||
| JP61283457A | ||||
| JP2008260035A |
Attorney, Agent or Firm:
Yohei Harada
Yoshihiro Morimoto
Yoshihiro Morimoto