Title:
潜在性硬化剤、それを含むエポキシ樹脂組成物、シール剤および有機ELディスプレイ
Document Type and Number:
Japanese Patent JP5486927
Kind Code:
B2
Abstract:
The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N-N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.
Inventors:
Hiroaki Tamaya
Mitsuaki Senda
Yugo Yamamoto
Yuichi Ito
Takashi Nakano
Yoshimura Shigetoshi
Mitsuaki Senda
Yugo Yamamoto
Yuichi Ito
Takashi Nakano
Yoshimura Shigetoshi
Application Number:
JP2009547910A
Publication Date:
May 07, 2014
Filing Date:
December 26, 2008
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08G59/50; C07C243/40; C07C271/28; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JPH08500339A | 1996-01-16 | |||
| JPS5357258A | 1978-05-24 | |||
| JPH10507753A | 1998-07-28 | |||
| JPH10139748A | 1998-05-26 | |||
| JP2003096061A | 2003-04-03 | |||
| JP2000229927A | 2000-08-22 |
Foreign References:
| WO2002051905A1 | 2002-07-04 | |||
| US3985807A | 1976-10-12 |
Attorney, Agent or Firm:
Koichi Washida