Title:
LATEX COMPOSITION AND DIP MOLDING
Document Type and Number:
Japanese Patent JP2022131081
Kind Code:
A
Abstract:
To provide a latex composition capable of imparting a film forming material such as a dip molding having high tearing strength at a relatively low temperature and within a short aging time.SOLUTION: A latex composition containing a latex of a water-insoluble conjugated diene polymer (A) having an absorbance of 0.3 or more at pH=8 and a solid content concentration of 3 wt.%, and a latex of pH=8 and an absorbance of smaller than 0.3 at a solid content concentration of 3 wt.%, in which the latex of the alkali-soluble conjugated diene polymer (B) is obtained by emulsifying polymerization of a monomer mixture containing a conjugated diene monomer and a water soluble monomer.SELECTED DRAWING: None
Inventors:
SATO YOSHITAKA
Application Number:
JP2021029821A
Publication Date:
September 07, 2022
Filing Date:
February 26, 2021
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
C08F236/08; C08L9/10
Attorney, Agent or Firm:
Eternal patent business corporation