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Title:
LAYER STRUCTURE THERMOCOUPLE
Document Type and Number:
Japanese Patent JPH01130579
Kind Code:
A
Abstract:
PURPOSE:To make a diameter extremely thin, and facilitate the temperature measurement of a living thing and the like at an arbitrary position, by sharply forming the tip of a thin wire whose section has a laminated structure, making it electrically conductive, and forming a connection point of dissimilar materials for a thermocouple at the tip part. CONSTITUTION:In a copper layer 1, a metal electric wire 3 like constantan is formed via an insulating layer 2. The tip part is sharply cut with inclination, and a conductive junction surface 4 is formed on the section, by plating, deposition, conductive coating material, etc. The copper layer 1 and the electric wire 3 are dissimilar metals having thermoelectromotive force. Electric potential difference generated between the copper layer 1 and the electric wire 3 by the temperature of the junction surface 4 is led out to the external part, by a lead wire 5 which is connected to the copper layer 1 and the electric wire 3, and extends toward the rear end with long length. By this structure, the junction surface 4 can be made very small, so that the thermal inertia is small, and the responce is quick. Since the tip is sharply formed, the temperature of arbitrary positions of living things and others can be easily measured.

Inventors:
KUSUMOTO AKIRA
Application Number:
JP29027687A
Publication Date:
May 23, 1989
Filing Date:
November 16, 1987
Export Citation:
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Assignee:
ISHIBASHI HIROSHI
KUSUMOTO AKIRA
International Classes:
G01K7/02; H01L35/32; (IPC1-7): G01K7/02; H01L35/32



 
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