LEAD FRAME AND ELECTRONIC COMPONENT USING IT

Title:

LEAD FRAME AND ELECTRONIC COMPONENT USING IT

Document Type and Number:

Japanese Patent JP2005019948

Kind Code:

A

Abstract:

To provide a lead frame whose electrical and mechanical reliability is substantially secured while cost is reduced, and also to provide an electronic component using it.

A lead frame 3 comprises a plate-like disc part 1, on which a chip, being a main body of the electronic component, is to be mounted, and a plate-like lead frame part 2 that has a thickness thinner than that of the disc part and should function as an electric external connection terminal of the electronic component. In this lead frame, the disc part has a protrusion, and the lead part has a through hole or a notch which engages with the protrusion. The disc part and the lead part are partially overlaid with each other so that the protrusion engages with the through hole or the notch. Further, the protrusion is plastically deformed, and the disc part is caulking-joined to the lead part.

Inventors:

MIYAMOTO TADASHI
KAMIKAWA YOSHIHIRO
ASADA KENICHI
SUGAWARA SHIGEAKI
NOMURA TAKEO

Application Number:

JP2004033851A

Publication Date:

January 20, 2005

Filing Date:

February 10, 2004

Export Citation:

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Assignee:

HIMEJI TOSHIBA EP CORP

International Classes:

H01L23/50; H01L23/48; (IPC1-7): H01L23/48; H01L23/50

Attorney, Agent or Firm:

Yoshihiro Tsunoda
Yasu Furukawa
Toshio Nishitani
Keiji width
Izumi Uchiyama
Yosuke Koreeda

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