PURPOSE: To prevent a defect such as the bend of a lead or the like caused when a tie bar is cut and to make a lead pitch fine by a method wherein the tie bar which connects leads is abolished.
CONSTITUTION: A die pad 2 on which a semiconductor chip is loaded is arranged in the central part of a lead frame 1. A plurality of leads 3 are arranged at the outside of the die pad 2 so as to surround the die pad 2. Suspension leads 4 which support the die pad 2 are installed at four corners of the die pad 2. A tie bar which supports the leads 3 is not installed at the halfway part of the leads 3. The outermost circumferential part is composed of an outer frame 5 and an inner frame 6; guide holes 7 used to position the lead frame in a prescribed position at a molding metal mold are formed in the outer frame 5. Since the tie bar is abolished in this manner, a tie-bar cutting process is not required after a package main body has been molded. Thereby, it is possible to prevent a defect such as the bend of a lead or the like caused when the tie bar is cut and to make a lead pitch fine.
HONDA ATSUSHI
HORIUCHI HITOSHI
SUZUKI HIROMICHI
OTSUKA KANJI
HITACHI VLSI ENG