Title:
LEAD FRAME MATERIAL FOR CERAMIC PACKAGE
Document Type and Number:
Japanese Patent JP3148488
Kind Code:
B2
Abstract:
PURPOSE: To provide a lead frame material for ceramic package that is most suitable for high frequency package, especially has low thermal expansion, low electrical resistance and high thermal conductivity and has a construction by which the strength of Al wire bonding is hardly lowered.
CONSTITUTION: A Cu layer 11 is covered on the entire surface of a low thermal expansion material 10 such as an Fe-Ni alloy, etc., through vapor phase film formation method such as plating or vapor deposition, etc., and further an Ni layer 12 is formed on the Cu lay 11 on the upper face in an inner lead part 4 through the same method. Furthermore, an Al layer 13 is formed on the layer 12 in the same manner, and as the result, when a high frequency of more than 10MHz is given, a current is flown in only the layer 11 because of skin effect and it is hardly influenced by the material 10 as a base material, thereby realizing high-speed operation of a signal line. In addition, since the layer 13 is formed on the layer 11 in the part 4 with the layer 12 in between, the same bonding strength as that directly formed on the surface of the material 10 such as an Fe-Ni alloy, etc., can be obtained.
Inventors:
Masaharu Yamamoto
Application Number:
JP34165193A
Publication Date:
March 19, 2001
Filing Date:
December 10, 1993
Export Citation:
Assignee:
Sumitomo Special Metal Co., Ltd.
International Classes:
H05K1/05; H01L23/50; (IPC1-7): H05K1/05; H01L23/50
Domestic Patent References:
| JP63261733A | ||||
| JP63172167U |
Attorney, Agent or Firm:
Shigenobu Ikejou (1 person outside)