PURPOSE: To obtain a resin sealed semiconductor device having a good external shape by a method wherein a sealing resin and a nonadhesive or low-adherence film are provided on a frame including a resin pouring part to facilitate the removal of a resin formed on the resin pouring part.

CONSTITUTION: A molding resin and a nonadhesive or low-adherence film 14 are formed on a resin pouring part on a frame 7 of a lead frame. Resins 12 and 13 are formed of a resin poured through the part 8 on the outer diameter of a resin-sealed semiconductor device and the part 8. As a silver film is formed on the part 8 to come into contact with the resin 13, the resin 13 is coupled with the resin 12 at the boundary part only between the resins 12 and 13. Hereupon, the resin 13 is completely removed without breaking the adhesion interfaces between inner leads 3 and suspension leads 5 and the resin 12. Thereby, the resin-sealed semiconductor device having a good external shape is obtained.