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Title:
LEAD FRAME FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2000012753
Kind Code:
A
Abstract:

To prevent the generation of burrs on the circumference of a lead part, when a resin sealing is performed using a transfer mold.

This lead frame is provided with a positive pole external lead 10a positioned on both ends of the lead frame, extended material parts 7 and 9 having a plurality of pieces which protrude in parallel with a middle rail and in the same direction outside a negative lead 10b and a supporting part 8. The extended material parts are pressed by a metal mold, and a resin sealing operation is performed using a transfer mold. Accordingly, even if there is a leakage of mold resin, it is stopped by the extended material parts 7 and 9 and the supporting part 8, and the resin burrs on the external lead part can be prevented from forming.


Inventors:
MORIBE SHOZO
Application Number:
JP17242398A
Publication Date:
January 14, 2000
Filing Date:
June 19, 1998
Export Citation:
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Assignee:
MATSUSHITA ELECTRONICS CORP
International Classes:
H01L23/28; H01L23/48; H01L31/02; H01L33/56; H01L33/62; (IPC1-7): H01L23/48; H01L23/28; H01L31/02; H01L33/00
Attorney, Agent or Firm:
Tomoyuki Takimoto (1 person outside)



 
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