Title:
LEAD FRAME AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2007266506
Kind Code:
A
Abstract:
To provide a lead frame capable of preventing a die pad or leads from tilting or deforming, and a semiconductor device.
The lead frame has the leads 13 and 13 coupled to the die pad 11 in one body and supported together with suspension pins 18 and 18, and consequently the die pad 11 is prevented from tilting.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
NAKANIWA KATSUKI
USUI KAORU
HIRATA SEIICHI
USUI KAORU
HIRATA SEIICHI
Application Number:
JP2006092411A
Publication Date:
October 11, 2007
Filing Date:
March 29, 2006
Export Citation:
Assignee:
MITSUMI ELECTRIC CO LTD
TAIHEI DENSHI KK
TAIHEI DENSHI KK
International Classes:
H01L23/50
Attorney, Agent or Firm:
Yukio Sato